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We also find that newly deposited hot molecules produce cascades of hot particles that propagate far into the film, possibly influencing the relaxation of the material., of the corresponding bulk material.
The properties of liquid-cooled, ‘ordinary’ glasses depend on cooling rate and on the ‘age’ of the glass—the amount of time that the material is allowed to rest at a given temperature (below T.
SPTS Rapier DRIE (*) – high rate Deep Reactive Ion Etcher for micromaching, trench etching, and through silicon via (TSV) etch Oxford Instruments Plasmalab 100 ICP-380 – Deep Reactive Ion Etcher (DRIE) for deep silicon etch applications Oxford Instruments Plasmalab 100 ICP-180 Chlorine – Inductively Coupled Plasma (ICP) etcher for silicon photonics and III-Vs Oxford Instruments Plasmalab 100 ICP-180 Fluorine – ICP high-density plasma etcher for silicon, oxides, nitrides Plasma Therm / Advanced Vacuum Vision Reactive Ion Etcher (RIE) (*) – etcher for silicon, oxides, nitrides on up to 200mm substrates Glow Research Auto Glow Barrel Asher – plasma asher for resist strip We have multiple systems for electron beam beam evaporation and sputter deposition.
For questions about PVD, contact the PVD area team.